Polymeric materials which directly form covalent bonds without adhesives
January 4, 2021
This technology directly bonds two materials without adhesives by stable and rigid covalent bonding
Key Word : polymer material, covalent bonding without adhesives, coordinate bond, hydrogen bond
Background / Context / Abstract:
Normally when two materials are bonded, bonding is addressed by applying an adhesive on the material surface to utilize the anchoring effect. However, there were problems such as a tendency to peel off the bonding surface, and adverse effects of intervention by components other than the materials that are bonded.
This technology directly bonds two materials without adhesives by covalent bonding, by having chemical reaction occur on material interface. There is no concern for peeling of the bonded surface, and stable and rigid bonding is addressed.
In addition, bonding and separation can be made reversible and controlled as necessary when a coordinate bond or hydrogen bond is used as the chemical bond.
As an experiment example, a gel containing a boronic acid group (PB-gel) and glass substrate containing an aryl halide group (I-Sub) were each prepared and the interfaces were brought into contact under the presence of a palladium catalyst, and the bonding strength increased up to 10 kPa in breaking strength as the number of substituents increased. Similar bonding was addressed for the gel and glass substrate between PB-Sub and I-gel or between gels (PG-gel and I-gel).
1. Bonding between a gel and glass substrate by Suzuki-Miyaura cross coupling reaction.
2. There are various chemical reactions which can be used for the covalent bonding in this technology other than the above, including azide-alkyne cycloaddition reaction (click reaction). Selective bonding with the application of complementary interaction in nucleic acid base pairing has also been demonstrated.
Potential Applications / Potential Markets:
・Bonding between materials for which conventional bonding was impossible or insufficient.
・Improvement in bonding strength, elimination of impurities, and process simplification with elimination of adhesive
・DNA sequence recognition marker, drugs and enzyme reaction reagents for research, etc.
State of Development / Opportunity / Seeking:
・Available for exclusive and non-exclusive licensing
・Exclusive/non-exclusive evaluation for defined period (set up for options)
WO2015/030079(Issued: JP, US)